SPIE Proceedings [SPIE ISMA '97 International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 23 June 1997)] Microelectronic Packaging and Laser Processing - Processing mechanics for flip-chip assembly
Wang, Jianjun, Qian, Zhengfang, Liu, Sheng, Swee, Yong Khim, Zheng, HongYu, Chen, Ray T.Том:
3184
Рік:
1997
Мова:
english
DOI:
10.1117/12.280580
Файл:
PDF, 879 KB
english, 1997