SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California (Sunday 21 February 2010)] Design for Manufacturability through Design-Process Integration IV - Improving copper CMP topography by dummy metal fill co-optimizing electroplating and CMP planarization
Chang, Li-Fu, Rieger, Michael L., Thiele, Joerg, Fan, Zhong, Lu, Daniel, Bao, AlexТом:
7641
Рік:
2010
Мова:
english
DOI:
10.1117/12.845496
Файл:
PDF, 312 KB
english, 2010