SPIE Proceedings [SPIE SPIE LASE - San Francisco, California, USA (Saturday 2 February 2013)] Laser-based Micro- and Nanopackaging and Assembly VII - Improvement of laser dicing system performance I: high-speed, high-quality processing of thick silicon wafers using spatial light modulator
Matsumoto, Naoya, Takiguchi, Yu, Itoh, Haruyasu, Hoshikawa, Masaharu, Iwaki, Hiroyuki, Hasegawa, Tsukasa, Nakano, Makoto, Oyaizu, Masaki, Sakamoto, Takeshi, Ogiwara, Takafumi, Inoue, Takashi, KlotzbacТом:
8608
Рік:
2013
Мова:
english
DOI:
10.1117/12.2003639
Файл:
PDF, 1014 KB
english, 2013
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