[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Fabrication and Characterization of Low Stress Si Interposer with Air-Gapped Si Interconnection for Hermetical System-in-Package
Luo, Rongfeng, Ren, Kuili, Ma, Shenglin, Yan, Jun, Xia, Yanming, Jin, Yufeng, Chen, Jing, Wu, Tianzhun, Yang, Hangao, Yuan, LifangРік:
2016
Мова:
english
DOI:
10.1109/ectc.2016.129
Файл:
PDF, 1.01 MB
english, 2016
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