3-D TSV Six-Die Stacking and Reliability Assessment of 20- $\mu$ m-Pitch Bumps on Large-Scale Dies
Lee, Jong Bum, Aw, Jie Li, Rhee, Min WooТом:
7
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2016.2628372
Date:
January, 2017
Файл:
PDF, 2.57 MB
english, 2017
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