Stress-warping relation in thin film coated wafers
Schicker, J, Khan, W A, Arnold, T, Hirschl, CТом:
25
Мова:
english
Журнал:
Modelling and Simulation in Materials Science and Engineering
DOI:
10.1088/1361-651X/aa5331
Date:
February, 2017
Файл:
PDF, 1.74 MB
english, 2017