Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging
Lee, Byung-Suk, Hyun, Soong-Keun, Yoon, Jeong-WonТом:
28
Мова:
english
Журнал:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-017-6479-4
Date:
June, 2017
Файл:
PDF, 3.75 MB
english, 2017