Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C
He, Ran, Fujino, Masahisa, Akaike, Masatake, Sakai, Taiji, Sakuyama, Seiki, Suga, TadatomoТом:
414
Мова:
english
Журнал:
Applied Surface Science
DOI:
10.1016/j.apsusc.2017.03.168
Date:
August, 2017
Файл:
PDF, 1.03 MB
english, 2017