[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes - Analytic Optimization of Cost Effective Thermoelectric Generation on Top of Rankine Cycle
Yazawa, Kazuaki, Koh, Yee Rui, Shakouri, AliРік:
2013
Мова:
english
DOI:
10.1115/ipack2013-73195
Файл:
PDF, 1.18 MB
english, 2013