Wire bond degradation under thermo- and pure mechanical loading
Pedersen, Kristian Bonderup, Nielsen, Dennis A., Czerny, Bernhard, Khatibi, Golta, Iannuzzo, Francesco, Popok, Vladimir N., Pedersen, KjeldМова:
english
Журнал:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2017.07.055
Date:
July, 2017
Файл:
PDF, 999 KB
english, 2017