Analysis of Solderless Press-Fit Interconnections During the Assembly Process
Tohmyoh, Hironori, Yamanobe, Kiichiro, Saka, Masumi, Utsunomiya, Jiro, Nakamura, Takeshi, Nakano, YoshikatsuТом:
130
Рік:
2008
Мова:
english
Журнал:
Journal of Electronic Packaging
DOI:
10.1115/1.2957330
Файл:
PDF, 443 KB
english, 2008