Study of direct soldering of Al2O3 ceramics and Cu substrate by use of Bi11Ag2La solder
Koleňák, Roman, Hodúlová, ErikaМова:
english
Журнал:
Welding in the World
DOI:
10.1007/s40194-017-0538-6
Date:
December, 2017
Файл:
PDF, 7.64 MB
english, 2017