SMT Solder Joint Inspection via a Novel Cascaded Convolutional Neural Network
Cai, Nian, Cen, Guandong, Wu, Jixiu, Li, Feiyang, Wang, Han, Chen, XinduРік:
2018
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2789453
Файл:
PDF, 1.58 MB
english, 2018