[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw, Poland (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Ceramic packaging of PiezoMEMS devices
Belavic, Darko, Muscalu, George, Vojisavljevic, Katarina, Hodnik, Marjan, Kuscer, Danjela, Kos, Tomaz, Pecnik, Tanja, Drnovsek, Silvo, Zajac, Jerzy, Malic, Barbara, Anghelescu, AdrianРік:
2017
Мова:
english
DOI:
10.23919/EMPC.2017.8346888
Файл:
PDF, 624 KB
english, 2017
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