In-situ characterization of moisture absorption and hygroscopic swelling of silicone/phosphor composite film and epoxy mold compound in LED packaging
Khalilullah, Ibrahim, Reza, Talukder, Chen, Liangbiao, Placette, Mark, Mazumder, A.K.M. Monayem H., Zhou, Jiang, Fan, Jiajie, Qian, Cheng, Zhang, Guoqi, Fan, XuejunТом:
84
Мова:
english
Журнал:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2018.03.025
Date:
May, 2018
Файл:
PDF, 1.34 MB
english, 2018
File converter
Більше результатів пошуку
More benefits 
