[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse, France (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - CFD-based iterative methodology for modeling natural convection in microelectronic packages
Toure, Mamadou Kabirou, Momar Souare, Papa, Allard, Stephanie, Foisy, Benoit, Duchesne, Eric, Sylvestre, JulienРік:
2018
Мова:
english
DOI:
10.1109/EuroSimE.2018.8369862
Файл:
PDF, 1.39 MB
english, 2018
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