Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems
Okabe, Kenji, Jeewan, Horagodage, Yamagiwa, Shota, Kawano, Takeshi, Ishida, Makoto, Akita, IppeiТом:
15
Мова:
english
Журнал:
Sensors
DOI:
10.3390/s151229885
Date:
December, 2015
Файл:
PDF, 6.36 MB
english, 2015
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