Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Ko, Cheng-Ta, Yang, Henry, Lau, John H., Li, Ming, Li, Margie, Lin, Curry, Lin, J. W., Chen, Tony, Xu, Iris, Chang, Chieh-Lin, Pan, Jhih-Yuan, Wu, Hsing-Hui, Yong, Qing Xiang, Fan, Nelson, Kuah, Eric,Рік:
2018
Мова:
english
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2018.2848665
Файл:
PDF, 5.12 MB
english, 2018
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