[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Low Cost Panel-Based 1-2 Micron RDL Technologies with Lower Resistance than Si BEOL for Large Packages
Liu, Fuhan, Ito, Hirokazu, Zhang, Rui, DeProspo, Bartlet H, Benthaus, Fabian, Akimaru, Hisanori, Hasegawa, Kouichi, Sundaram, Venky, Tummala, Rao RРік:
2018
Мова:
english
DOI:
10.1109/ECTC.2018.00097
Файл:
PDF, 691 KB
english, 2018
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