[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Three-dimensional (3D) Characterization of Electromigration Failure Mechanism of Solder Joints in WLP using X-ray Microscopy
Chang, Jaewon, Choi, Hyunjun, Kim, Jinseok, Park, Sangkwon, Jo, Yoonkyeong, Jeong, Tae-Young, Soo Yeo, Myung, Kang, Hanbyul, Park, Junekyun, Shin, Sangchul, Pae, SangwooРік:
2018
Мова:
english
DOI:
10.1109/IPFA.2018.8452493
Файл:
PDF, 5.30 MB
english, 2018
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