Interfacial Behaviors in Cu/Molten Sn–58Bi/Cu Solder Joints Under Coupling with Thermal and Current Stressing
Wang, Fengjiang, Chen, Hong, Li, Dongyang, Zhang, Zhijie, Wang, XiaojingМова:
english
Журнал:
Electronic Materials Letters
DOI:
10.1007/s13391-018-00102-x
Date:
November, 2018
Файл:
PDF, 3.89 MB
english, 2018