Pinch Off Plasma CVD Deposition Process and Material Technology for Nano-Device Air Gap/Spacer Formation
Nguyen, Son, Haigh, T., Cheng, K., Penny, C., Park, C., Li, J., Mehta, S., Yamashita, T., Jiang, L., Canaperi, D.Том:
7
Рік:
2018
Мова:
english
Журнал:
ECS Journal of Solid State Science and Technology
DOI:
10.1149/2.0021811jss
Файл:
PDF, 1.60 MB
english, 2018