[IEEE 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Singapore (2018.7.16-2018.7.19)] 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - A Study for the Effectiveness of Wire Bond Process Parameters on AI-Cu Intermetallic Compound Distributions and the Correlation between Bonded Ball Adhesions and IMC Coverage