A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process
Lin, Pengrong, Xie, Xiaochen, Wang, Yong, Lian, Binhao, Zhang, GuoqiМова:
english
Журнал:
Microsystem Technologies
DOI:
10.1007/s00542-018-4249-8
Date:
December, 2018
Файл:
PDF, 2.35 MB
english, 2018
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