A Heterogeneous Array of Off-Chip Interconnects for Optimum Mechanical and Electrical Performance
Kacker, Karan, Sokol, Thomas, Yun, Wansuk, Swaminathan, Madhavan, Sitaraman, Suresh K.Том:
129
Рік:
2007
Мова:
english
Журнал:
Journal of Electronic Packaging
DOI:
10.1115/1.2804096
Файл:
PDF, 1.30 MB
english, 2007