[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - High Yield Chip-on-wafer Low Temperature Plasma Activated Bonding for III-V/Si Hybrid Photonic Integration
Kikuchi, Takehiko, Bai, Liu, Mitarai, Takuya, Yagi, Hideki, Amemiya, Tomohiro, Nishiyama, Nobuhiko, Arai, ShigehisaРік:
2019
Мова:
english
DOI:
10.23919/LTB-3D.2019.8735148
Файл:
PDF, 252 KB
english, 2019