[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Die-to-Wafer (D2W) Processing and Reliability for 3D Packaging of Advanced Node Logic
England, Luke, Fisher, Daniel, Rivera, Katie, Guthrie, Bill, Kuo, Ping-Jui, Lee, Chang-Chi, Hsu, Che-Ming, Min, Fan-Yu, Kang, Kuo-Chang, Weng, Chen-YuanРік:
2019
Мова:
english
DOI:
10.1109/ECTC.2019.00096
Файл:
PDF, 541 KB
english, 2019
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