[IEEE 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - KAOHSIUNG, Taiwan (2019.12.16-2019.12.18)] 2019 Electrical Design of Advanced Packaging and Systems (EDAPS) - Design and Analysis of High-Definition Multimedia Interface Connectors considering Signal Integrity
Kumar, Gaurav, Park, Gapyeol, Park, Hyunwook, Lho, Daehwan, Park, Junyong, Kim, Joungho, Lee, Junho, Choi, SeongminРік:
2019
DOI:
10.1109/edaps47854.2019.9011664
Файл:
PDF, 601 KB
2019
File converter
Більше результатів пошуку
More benefits 
