Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination
Kwatra, Abhishek, Samet, David, Rambhatla, V.N.N. Trilochan, Sitaraman, Suresh K.Том:
111
Журнал:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2020.113647
Date:
August, 2020
Файл:
PDF, 1.59 MB
2020