Significant Die-Shift Reduction and μLED Integration Based on Die-First Fan-Out Wafer-Level Packaging for Flexible Hybrid Electronics
Fukushima, Takafumi, Susumago, Yuki, Qian, Zhengyang, Shima, Chidai, Du, Bang, Takahashi, Noriyuki, Nagata, Shuta, Odashima, Tomo, Kino, Hisashi, Tanaka, TetsuРік:
2020
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2020.3009640
Файл:
PDF, 1.59 MB
2020
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