A Low-Loss Fan-Out Wafer-Level Package With a Novel Redistribution Layer Pattern and Its Measurement Methodology for Millimeter-Wave Application
Dong, Haoyi, Chen, Jixin, Hou, Debin, Xiang, Yu, Hong, WeiТом:
10
Журнал:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2020.3000279
Date:
July, 2020
Файл:
PDF, 1.46 MB
2020
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