[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
Mathur, Rahul, Chao, Chien-Ju, Liu, Rossana, Tadepalli, Nikhil, Chandupatla, Pranavi, Hung, Shawn, Xu, Xiaoqing, Sinha, Saurabh, Kulkarni, JaydeepРік:
2020
DOI:
10.1109/ECTC32862.2020.00091
Файл:
PDF, 1.18 MB
2020
File converter
Більше результатів пошуку
More benefits 
